Embedded coins for HDI or SEQ laminations

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9661738
SERIAL NO

14476549

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Abstract

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A method of and a device for dissipating/transferring heat through one or more solid vias and embedded coins are disclosed. The method and device disclosed herein can be used to transfer heat for a High Density Interconnect (HDI) board.

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Patent Owner(s)

Patent OwnerAddress
FLEX LTD2 CHANGI SOUTH LANE SINGAPORE 486123

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jacobsson, Henrik Kullavik, SE 14 65
Yu, Pui Yin Tsuen Wan, HK 15 53

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