Methods of fabricating QFN semiconductor package and metal plate
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United States of America Patent
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May 23, 2017
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app pub date -
Sep 23, 2015
filing date -
Apr 27, 2010
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Abstract
A method for fabricating a quad flat non-leaded (QFN) package includes: forming die pads and bump solder pads by pressing a metal plate, wherein each of the die pads and the bump solder pads has at least a cross-sectional area greater than another cross-sectional area located underneath along its vertical thickness dimension, thereby enabling the die pads and the solder pads to be securely embedded in an encapsulant.
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