Reactive hot-melt adhesive for use on electronics

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United States of America Patent

PATENT NO 9659832
SERIAL NO

14233962

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Abstract

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The disclosure relates to a method of making an electronic assembly with a reactive hot-melt adhesive composition that include an atmospheric curing prepolymer and optionally a thermoplastic component with a softening point of at least about 120° C., and the electronic assembly made therewith.

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Patent Owner(s)

  • H.B. FULLER COMPANY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Giorgini, Albert M Lino Lakes, US 17 60
Hilley, Andrew Stirlingshire, GB 1 7

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