Reflow film, solder bump formation method, solder joint formation method, and semiconductor device
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United States of America Patent
Stats
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May 23, 2017
Issued Date -
N/A
app pub date -
Oct 26, 2012
filing date -
Oct 26, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.
First Claim
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Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
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| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 23, 2024 |
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