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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HIROSHIMA UNIVERSITY	3-2 KAGAMIYAMA 1-CHOME HIGASHIHIROSHIMA-SHI HIROSHIMA 7398511 ?7398511

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• C22C:ALLOYS
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Matsugi, Kazuhiro	Higashihiroshima, JP	3	4
Suetsugu, Kenichiro	Nishinomiya, JP	34	337

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 23, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 23, 2017	US,9656351,B2   US9656351B2	GRANTED PATENT AS SECOND PUBLICATION
December 08, 2016	US,20160354868,A1   US20160354868A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9656351

Solder material and connected structure

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