Removal of selected portions of protective coatings from substrates

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United States of America Patent

PATENT NO 9656350
SERIAL NO

14861929

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Abstract

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A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
HZO INC12637 SOUTH 265 WEST DRAPER UT 84020

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Astle, David J Park City, US 1 2
Child, Tyler C South Jordan, US 1 2
Kasagani, Vimal K Taylorsville, US 1 2
Loose, Cameron L Roy, US 1 2
Sorenson, Max E Cottonwood Heights, US 4 18
Stevens, Blake L Morristown, US 2 2

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