High-frequency package
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United States of America Patent
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May 16, 2017
Grant Date -
Feb 16, 2017
app pub date -
Oct 14, 2015
filing date -
Aug 13, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A high-frequency package comprises a die; a plurality of leads; and a die pad; wherein a surface of the die pad is lower than top surfaces of the plurality of leads, the die is disposed on the die pad with the lower surface, such that a top surface of the die is substantially aligned with the top surfaces of the plurality of leads.
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