Semiconductor package and method of manufacturing the same
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United States of America Patent
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May 16, 2017
Issued Date -
N/A
app pub date -
Sep 25, 2015
filing date -
Oct 1, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed herein are a semiconductor package and a method of manufacturing the same, which allows a conductive path to be provided to connect upper and lower portions of the semiconductor package. A semiconductor package according to the present invention includes a semiconductor chip, a substrate including an accommodating portion to accommodate the semiconductor chip, a sealing material configured to mold the semiconductor chip and the substrate to be integrated, a through wiring configured to vertically pass through the substrate, a wiring portion configured to electrically connect the semiconductor chip and one side of the through wiring, and an external connection portion to electrically connected to the other side of the through wiring and configured to be able to be electrically connected to an outside, wherein a wiring layer of the wiring portion is provided to be connected to the through wiring.
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