Heat dissipation solution for advanced chip packages
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United States of America Patent
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May 16, 2017
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N/A
app pub date -
May 4, 2015
filing date -
Aug 4, 2014
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Abstract
A solution for dissipating heat generated from high power chip packages, e.g., a fcBGA package, wbBGA package, 2.5D/3D TSV package, PoP, etc. The heat dissipation system may include a high power chip package including a high power chip. A micro-jet may be attached to the high power chip. A micro-pump may be in fluidic communication with the micro-jet. A heat exchanger may be in fluidic communication with the micro-pump. The high power chip package is assembled on the same PCB with the micro-pump and the heat exchanger.
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