Manufacturing method of substrate structure having embedded interconnection layers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 16, 2017
Issued Date -
N/A
app pub date -
Mar 4, 2016
filing date -
Nov 29, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A manufacturing method of a substrate structure is provided. The method includes the following steps. Firstly, a conductive carrier is provided. Then, a first metal layer is formed on the conductive carrier. Then, a second metal layer is formed on the first metal layer. Then, a third metal layer is formed on the second metal layer, wherein each of the second metal layer and the third metal layer has a first surface and a second surface opposite to the first surface, the first surface of the third metal layer is connected to the second surface of the second metal layer, the surface area of the first surface of the third metal layer is larger than the surface area of the second surface of the second metal layer, and the first metal layer, the second metal layer and the third metal layer form a conductive structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully