High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella
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United States of America Patent
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May 16, 2017
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Sep 26, 2013
app pub date -
Nov 30, 2012
filing date -
Dec 1, 2011
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Abstract
A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.
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