Compound and composition for forming lower film of resist pattern, and method for forming lower film using same

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United States of America Patent

PATENT NO 9651867
APP PUB NO 20150286139A1
SERIAL NO

14427010

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Abstract

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Disclosed are a compound and composition for forming a lower film, which are used in a process for forming a resist pattern by means of the directed self-assembly of a block copolymer (BCP). Also disclosed is a method for forming a lower film using same. The compound for forming a lower film of a resist pattern according to the present invention has the structure of formula 1 of claim 1.

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Patent Owner(s)

Patent OwnerAddress
DONGJIN SEMICHEM CO LTDINCHON SOUTH KOREA INCHEON

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Su-Young Gyeonggi-do, KR 1 2
Kim, Jae-Hyun Seoul, KR 351 2242
Lee, Jae-Woo Gyeonggi-do, KR 47 304
Lee, Jung-Youl Gyeonggi-do, KR 13 92

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