Semiconductor package and method of estimating surface temperature of semiconductor device including the same
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United States of America Patent
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May 16, 2017
Grant Date -
Sep 4, 2014
app pub date -
Dec 20, 2013
filing date -
Mar 4, 2013
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Abstract
A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.
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