Thermal exchange food processing device and method of producing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 16, 2017
Grant Date -
Jun 12, 2014
app pub date -
Dec 6, 2013
filing date -
Dec 7, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A thermal exchange food processing device includes a thermal conductive body, a thermal insulation layer and a phase change material. The thermal conductive body has an acting region and an inner thermal conductive region corresponding to, and in thermal connection with, the acting region. The thermal insulation layer has a lower thermal conductivity coefficient than the thermal conductive body and encapsulates, at least in part, the thermal conductive body, so that the acting region of the thermal conductive body is exposed while the remaining regions of the thermal conductive body other than the acting region are thermally insulated from ambient temperature. The thermal conductive body, alone or together with the thermal insulation layer, defines an accommodation space, and the inner thermal conductive region is situated to face the accommodation space. The phase change material is within the accommodation space.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2013 Application Filing Year
- B26B Class
- 242 Applications Filed
- 220 Patents Issued To-Date
- 90.91 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- B26B Class
- 22.48 % this patent is cited more than
- 8 Age
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