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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
RESONAC PACKAGING CORPORATION	60 KIYOSAKICHO HIKONE-SHI SHIGA 529-1156

International Classification(s)

• H01M:PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

• 2015 Application Filing Year
• H01M Class
• 5536 Applications Filed
• 4391 Patents Issued To-Date
• 79.32 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Minamibori, Yuji	Isehara, JP	14	30
# of filed Patents : 14 Total Citations : 30
Wang, Honglin	Isehara, JP	13	39
# of filed Patents : 13 Total Citations : 39

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Patent Citation Ranking

• 0 Citation Count
• H01M Class

• 0 % this patent is cited more than
• 8 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Nov 16, 2024
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 16, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 16, 2017	US,9649827,B2   US9649827B2	GRANTED PATENT AS SECOND PUBLICATION
March 31, 2016	US,20160089861,A1   US20160089861A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9649827

Molding packaging material and molded case

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Abstract

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A molding packaging material includes an outer substrate layer made of a heat-resistant resin, an inner sealant layer made of a thermoplastic resin, a metallic foil layer provided between the outer substrate layer and the inner sealant layer, and a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer. The protection coat layer is made of a resin composition including a main resin containing a phenoxy resin and a urethane resin, and a curing agent, and has a thickness of 0.1 μm to 10 μm.

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Description

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Claims

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Legal Events

 

• MAFP2024
• AS2023
• MAFP2020
• I2017
• STCF2017
• P2016
• AS2015
• F2015
• PD2014

Date	Code	Event	Description
Oct 30, 2024	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 8
Jan 01, 2023	AS	ASSIGNMENT	free format text: CHANGE OF NAME;ASSIGNOR:SHOWA DENKO PACKAGING CO., LTD.;REEL/FRAME:064374/0937 Owner name: RESONAC PACKAGING CORPORATION, JAPAN Effective Date: Jan 01, 2023
Nov 04, 2020	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
May 16, 2017	I	Issuance
Apr 26, 2017	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Mar 31, 2016	P	Published
Oct 16, 2015	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, HONGLIN;MINAMIBORI, YUJI;SIGNING DATES FROM 20151009 TO 20151013;REEL/FRAME:036807/0394 Owner name: SHOWA DENKO PACKAGING CO., LTD., JAPAN
Sep 29, 2015	F	Filing
Sep 30, 2014	PD	Priority Date