Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium
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United States of America Patent
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May 16, 2017
Issued Date -
N/A
app pub date -
Jan 30, 2012
filing date -
Feb 2, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for electrically contacting terminal faces of two substrates, such as a chip and a carrier substrate, includes two successive phases. In a first phase, the chip is positioned with its terminal faces against terminal faces of the substrate and laser energy is applied to the chip at the rear. In a second phase, a flux medium is applied and laser energy is applied to the rear of the chip to cause reflow. The device for performing the second phase of the method comprises a carrier table and a housing, which form a housing interior with a top side of the carrier table which receives the component arrangement, and a laser light source, which is oriented so that the laser radiation impinges on the rear side of the first substrate.
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