Ceramic substrate including thin film multilayer surface conductor
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United States of America Patent
Stats
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May 9, 2017
Issued Date -
N/A
app pub date -
Sep 30, 2014
filing date -
Sep 30, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.
First Claim
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Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| WO | A1 | WO2015048808 | Sep 30, 2014 |
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H05K Class
- 18.22 % this patent is cited more than
- 8 Age
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 9, 2024 |
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