Methods for adhesive bonding of electronic devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9647189
SERIAL NO

15006232

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Abstract

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In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.

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Patent Owner(s)

Patent OwnerAddress
COOLEDGE LIGHTING INC13551 COMMERCE PARKWAY SUITE 120 RICHMOND BRITISH COLUMBIA V6V 2L1

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amini, Alborz Vancouver, CA 12 138
Tischler, Michael A Vancouver, CA 178 5255

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