Wafer-level flip chip device packages and related methods

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United States of America Patent

PATENT NO 9647188
APP PUB NO 20160087179A1
SERIAL NO

14952294

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Abstract

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In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.

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Patent Owner(s)

Patent OwnerAddress
COOLEDGE LIGHTING INC13551 COMMERCE PARKWAY SUITE 120 RICHMOND BRITISH COLUMBIA V6V 2L1

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tischler, Michael A Vancouver, CA 178 5255

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