LED packaging structure having stacked arrangement of protection element and LED chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 9, 2017
Grant Date -
Jul 14, 2016
app pub date -
Jan 13, 2016
filing date -
Jan 14, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully