Parallel optical interconnect
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United States of America Patent
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May 9, 2017
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N/A
app pub date -
Aug 22, 2012
filing date -
Nov 29, 2011
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Abstract
A method for assembling an optical interconnect apparatus is provided. The optical interconnect comprises an integrated circuit chip, and at least one optoelectronic chip positioned on the integrated circuit chip, each of the at least one optoelectronic chip including a 2-dimensional optoelectronic array. The optical interconnect further comprises a first and a second microlens array, a bundle of optical fibers coupled to each second microlens array and supported by a bundle housing, and a block structure supporting the bundle housing to a printed circuit board (PCB).
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