Encapsulation process enabling hotbar soldering without direct PCB support
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United States of America Patent
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May 9, 2017
Issued Date -
N/A
app pub date -
Aug 14, 2014
filing date -
Aug 14, 2014
priority date (Note) -
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Abstract
A method for connecting or terminating wires to a printed circuit is disclosed. The method includes applying layers, such as a first layer and a second layer, to the printed circuit. The first layer is applied over several active components on the printed circuit, and provides a sealant against ingress of contaminants in the active components. The second layer is a rigid layer applied over the first layer. When the printed circuit is placed in a fixture, a metallic element, such as a thermode or hot bar, presses against the wires to hold the wires against several terminals on the printed circuit. The metallic element is heated to melt solder between the wires and the terminals. The second layer is configured to resist compressive forces from the metallic element and the fixture, such that the printed circuit and the active components are not damaged during the connection process.
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