Casting investment composition and casting process using same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 9, 2017
Grant Date -
May 21, 2015
app pub date -
Jun 17, 2013
filing date -
Jun 17, 2013
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
The object of the present invention is to provide an embedding material composition for casting that makes it possible to conduct a favorable casting in the case where casting is conducted using a resin pattern that is different from a conventional wax pattern in disappearance temperature and disappearance behaviors through “rapid heating” excellent in treatment efficiency. The present invention relates to an embedding material composition for casting not using a heat-expandable refractory material as a main component, comprising: a binder; and a non-heat-expandable refractory material having an average particle diameter of 5 to 20 μm as main components, in which a content of the binder is 25 to 40 parts by mass and a content of the non-heat-expandable refractory material is 60 to 75 parts by mass in the case where the total amount of the main components is 100 parts by mass, and the present invention also relates to a casting process using the embedding material composition for casting.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- YOSHINO GYPSUM CO., LTD.
International Classification(s)

- 2013 Application Filing Year
- A61C Class
- 767 Applications Filed
- 667 Patents Issued To-Date
- 86.97 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Mamada, Emi | Tokyo, JP | 3 | 4 |
# of filed Patents : 3 Total Citations : 4 | |||
Sugano, Kenichi | Tokyo, JP | 9 | 25 |
# of filed Patents : 9 Total Citations : 25 | |||
Yoshikane, Masato | Tokyo, JP | 4 | 6 |
# of filed Patents : 4 Total Citations : 6 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- A61C Class
- 0 % this patent is cited more than
- 8 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 9, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
