Stacked electronic packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9640517
APP PUB NO 20150237721A1
SERIAL NO

14527165

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Importance

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Abstract

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A stacked electronic package includes a substrate and conductive straps each having sides, a top, and a bottom opposite the top. Each conductive strap is coupled along the bottom to an upper surface of the substrate and is separate from others of the conductive straps. A length of at least one of the sides is greater than a width of at least another one of the sides. An encapsulant extends over the upper surface and side surfaces of the substrate and the sides of the conductive straps. A passive electronic component is disposed over the conductive straps, and each conductive strap is coupled along the top to a terminal of the passive electronic component.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
CARSEM (M) SDN BHDS - SITE LOT 52986 TAMAN MERU INDUSTRIAL ESTATE JELAPANG P O BOX 380 IPOH PERAK DARUL RIDZUAN 30020

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choh, Thong Kai Ipoh, MY 1 5
Khor, Lily Ipoh, MY 11 521
Yee, Oo Choo Ipoh, MY 1 5

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