Wire bonding apparatus comprising an oscillator mechanism
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United States of America Patent
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May 2, 2017
Grant Date -
Jan 28, 2016
app pub date -
Jul 20, 2015
filing date -
Jul 24, 2014
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Abstract
A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.
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