Leadless electronic packages for GaN devices
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United States of America Patent
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May 2, 2017
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N/A
app pub date -
Feb 22, 2016
filing date -
Feb 24, 2015
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Abstract
Leadless electronic packages for GaN-based half bridge power conversion circuits have low inductance internal and external connections, high thermal conductivity and a large separation between external connections for use in high voltage power conversion circuits. Some electronic packages employ “L” shaped power paths and internal low impedance die to die connections. Further embodiments employ an insulative substrate disposed within the electronic package for efficient power path routing and increased packaging density.
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