Semiconductor device having wiring pad and wiring formed on the same wiring layer
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United States of America Patent
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May 2, 2017
Grant Date -
May 30, 2013
app pub date -
Nov 21, 2012
filing date -
Nov 24, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed herein is a device that includes a first wiring provided as a first-level wiring layer and elongated in a first direction; and a first wiring pad provided as the first-level wiring layer, the first wiring pad being rectangular and including a first side edge that is elongated in the first direction and a second side edge that is elongated in a second direction crossing to the first direction, the first side edge being greater in length than the second side edge, the first wiring pad being greater in length in the second direction than the first wiring.
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