Etching apparatus and methods
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United States of America Patent
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May 2, 2017
Grant Date -
Jun 26, 2014
app pub date -
Mar 4, 2014
filing date -
Nov 14, 2011
priority date (Note) -
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Abstract
A method is for etching the whole width of a substrate to expose buried features. The method includes etching a face of a substrate across its width to achieve substantially uniform removal of material; illuminating the etched face during the etch process; applying edge detection techniques to light reflected or scattered from the face to detect the appearances of buried features; and modifying the etch in response to the detection of the buried feature. An etching apparatus for etching substrate across its width to expose buried is also disclosed.
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