Semiconductor device including stacked semiconductor chips
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United States of America Patent
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May 2, 2017
Grant Date -
Sep 17, 2015
app pub date -
Jun 1, 2015
filing date -
May 9, 2005
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Abstract
A method is disclosed for selecting a semiconductor chip in a stack of semiconductor chips interconnected by through-lines by receiving selection signals at the first terminals located on a first surface of the semiconductor chip, connecting each first terminal to a selected second terminal located on a second surface of the semiconductor chip where each selected second terminal is not aligned with the first terminal to which it is connected, and generating an internal signal based on a selected one of the received selection signals.
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