Transparent material processing with an ultrashort pulse laser
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United States of America Patent
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May 2, 2017
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N/A
app pub date -
Feb 13, 2013
filing date -
Sep 8, 2005
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Abstract
A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.
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International Classification(s)
- B28D:WORKING STONE OR STONE-LIKE MATERIALS
- C03B:MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR ....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
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