Modular cutting system, method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 2, 2017
Issued Date -
N/A
app pub date -
Jul 25, 2013
filing date -
Jul 25, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system, a method and a modular apparatus may use a wire loop to cut an object. The apparatus may have a wire loop connected to pulleys on a deck attached to a frame. The deck may move relative to the frame to direct the wire loop through the object. The apparatus may have arms that may hold the object being cut. The apparatus may be configured with different cutting decks to reduce the overall size of the apparatus and/or to facilitate cutting a particular object in a particular environment.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully