Porous metallic membrane
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United States of America Patent
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May 2, 2017
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app pub date -
Dec 23, 2013
filing date -
Dec 21, 2012
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Abstract
The present disclosure relates to a method of forming a metallic layer having pores extending therethrough, the method comprising the steps of: (a) contacting a cathode substrate with an electrolyte solution comprising at least one cation; reducing the cation to deposit the metallic layer on a surface of the cathode substrate; and (c) generating a plurality of non-conductive regions on the cathode substrate surface during reducing step (b); wherein the deposition of the metallic layer is substantially prevented on the non-conductive regions on the cathode substrate surface to thereby form pores extending through the deposited metallic layer. The present disclosure further provides a metallic porous membrane fabricated by the disclosed process.
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