Board level electromagnetic interference (EMI) shields with increased under-shield space
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United States of America Patent
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Apr 25, 2017
Grant Date -
Aug 4, 2016
app pub date -
Apr 27, 2015
filing date -
Jan 30, 2015
priority date (Note) -
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Abstract
According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.
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