Semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 25, 2017
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N/A
app pub date -
Jul 20, 2015
filing date -
Jul 24, 2014
priority date (Note) -
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Abstract
A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.
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