Attachment structures for building integrable photovoltaic modules
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Apr 25, 2017
Grant Date -
Feb 7, 2013
app pub date -
Aug 4, 2011
filing date -
Aug 4, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided are novel building integrable photovoltaic (BIP) modules having specially configured attachment structures for securing these modules to building structures and other BIP modules. In certain embodiments, a BIP module includes a base sheet supporting photovoltaic cells and having a rigid polymer portion and a flexible polymer portion. The flexible portion is designed to be penetrated with mechanical fasteners during installation. The flexible portion may include fastening pointers and/or through holes for identifying specific penetration locations. The rigid portion provides necessary structural rigidity and support to the module and more specifically to the photovoltaic cells. In certain other embodiments, a BIP module includes an adhesive bumper strip disposed along one edge of the module and configured for secure this module with respect to another module. During installation, the strip is positioned between a back sealing sheet of one module and a front sealing sheet of another module.
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International Classification(s)
- 2011 Application Filing Year
- H01L Class
- 19146 Applications Filed
- 15997 Patents Issued To-Date
- 83.56 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 5 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 25, 2028 |
