Performance enhancement of coating packaged ESC for semiconductor apparatus
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United States of America Patent
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Apr 25, 2017
Grant Date -
May 1, 2014
app pub date -
Oct 28, 2013
filing date -
Oct 29, 2012
priority date (Note) -
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Abstract
An advanced coating for electrostatic chuck used in plasma processing chamber is provided. The advanced coating is formed using plasma enhanced physical vapor deposition. The coating is generally of Y2O3/Al2O3, although other material combinations can be used. Also, a multi-layered coating can be formed, such that an intermediate coating layer can be formed using standard plasma spray, and a top coating can be formed using PEPVD. The entire ESC assembly can be “packaged” by the coating.
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