Selective reflectivity process chamber with customized wavelength response and method

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United States of America Patent

PATENT NO 9633876
APP PUB NO 20100219174A1
SERIAL NO

12776845

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Abstract

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A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.

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Patent Owner(s)

Patent OwnerAddress
MATTSON TECHNOLOGY INC47131 BAYSIDE PARKWAY FREMONT CA 94538
BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO LTDNO 8 BUILDING NO 28 JINGHAI ER RD BEIJING 100176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bordiga, Peter C Petaluma, US 3 43
Devine, Daniel J Los Gatos, US 31 2112
Hu, Yao Zhi San Jose, US 15 779
Lee, Young Jai Sunnyvale, US 9 1095
Timans, Paul J Mountain View, US 16 700

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