Label for in-mold molding, in-mold molded article and method for molding same
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United States of America Patent
Stats
-
Apr 25, 2017
Grant Date -
Dec 13, 2012
app pub date -
Oct 13, 2010
filing date -
Oct 14, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A label for in-mold molding, which comprises a laminate film comprising a substrate layer (A) and a heat-sealable resin layer (B), wherein the substrate layer (A) comprises a thermoplastic resin in an amount of from 40 to 90% by weight and at least one of an inorganic fine powder and an organic filler in an amount of from 10 to 60% by weight, the heat-sealable resin layer (B) comprises a thermoplastic resin in an amount of from 50 to 100% by weight, the laminate film is at least uniaxially stretched, the porosity of the laminate film is from 10% to 45%, the thermal conductivity of the label is from 0.04 to 0.11 W/mK, and the bonding strength of the label stuck to an adherend formed of a propylene-based resin at 200° C. and 60 MPa is from 250 to 1500 g/15 mm.
First Claim
Other Claims data not available
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- B29C Class
- 34.18 % this patent is cited more than
- 8 Age
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