Touch module and method of fabricating the same
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United States of America Patent
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Apr 25, 2017
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app pub date -
Jun 5, 2014
filing date -
Jun 5, 2014
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Abstract
The present invention relates to a touch module and a method of fabricating the touch module. The method comprises: providing a substrate plate, applying an adhesive layer on the substrate plate, forming a sensing line trough and a peripheral line trough on the adhesive layer, forming a first conductive layer in the sensing line trough and a second conductive layer in the peripheral line trough, wherein the first conductive layer in the sensing line trough serves as a sensing line, covering an anti acid film on the sensing line trough, electroplating an electroplated layer on the second conductive layer in the peripheral line trough, wherein the electroplated layer plus the second conductive layer serve as a peripheral line, and removing the anti acid film. Comparing to the prior art, the invention reduces the width of the peripheral line, lowers the resistance of the peripheral line, and improves yield rate.
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