Optical integrated device
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United States of America Patent
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Apr 25, 2017
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N/A
app pub date -
Nov 8, 2012
filing date -
Nov 10, 2011
priority date (Note) -
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Abstract
The invention is directed to the provision of an optical integrated device wherein provisions are made to be able to mount components on a substrate with high accuracy and high packing density without having to heat the components. The optical integrated device includes a substrate, an optical device optically coupled to a first device, and an electrical device mounted on top of the optical device or on top of a second device, wherein the optical device is bonded to the substrate by surface activated bonding via a first bonding portion formed from a metallic material on the substrate, and the electrical device is bonded to the optical device or the second device by surface activated bonding via a second bonding portion formed from a metallic material on the optical device or the second device.
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