Device for cooling a wall of a component
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United States of America Patent
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Apr 25, 2017
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N/A
app pub date -
Oct 17, 2014
filing date -
Oct 18, 2013
priority date (Note) -
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Abstract
The present invention relates to a device for cooling a wall of a component, where a fluid flow flows parallel to the wall, with at least one inflow duct, the center axis of which being arranged inclined to the plane of the wall, with a groove provided in the wall, into which issues the inflow duct, where a wall of the groove is designed contoured downstream of a discharge opening of the inflow duct and has an inflow edge facing the discharge opening, characterized in that the groove extends on both sides of the discharge opening and adjacent to the inflow edge at an angle to the direction of the fluid flow, and has a narrowing width.
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