Substrate for printed electronics and photonic curing process
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United States of America Patent
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Apr 25, 2017
Grant Date -
Aug 13, 2015
app pub date -
May 31, 2013
filing date -
Jun 5, 2012
priority date (Note) -
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Abstract
A coating layer 12 is formed on a base film 10 by heat resistant resin having a Tg (glass transition temperature) of 120° C. or more, and more preferably 200° C. or more, and a functional thin film 14 is produced by printing ink composite including conductive particles on a surface of the coating layer 12 and thereby forming an ink layer. This functional thin film 14 is sintered by heating performed by photo irradiation, and a conductive layer is formed thereby.
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