Soldering station with automatic soldering connection validation
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United States of America Patent
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Apr 18, 2017
Grant Date -
Feb 16, 2017
app pub date -
Nov 1, 2016
filing date -
Aug 4, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period.
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