Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 18, 2017
Issued Date -
N/A
app pub date -
Dec 2, 2013
filing date -
Aug 6, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is an etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with a chip. The structure comprises a metal substrate frame, wherein a base island and pins are arranged in the metal substrate frame; a chip is inversely arranged on a front face of the base island and the pins; a conductive pillar is arranged on a front face of the pins; the region on the periphery of the base island, the region between the base island and the pins, the region between one pin and another, the region above the base island and the pins, the region below the base island and the pins, and the outside of the chip and the conductive pillar are all enveloped with a plastic packaging material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully