Integrated circuit arrangement
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United States of America Patent
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Apr 18, 2017
Issued Date -
N/A
app pub date -
May 3, 2015
filing date -
May 30, 2014
priority date (Note) -
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Abstract
An integrated circuit arrangement includes a flange, a transistor die, and a first conducting element defining a lead. The flange includes a conducting material and the transistor die is disposed on a surface of the flange. The first conducting element is electrically connected to the transistor die via connecting elements to allow current flow from the transistor die. The flange defines return current paths allowing the current flow via the connecting elements and the lead to return to the transistor die. The flange includes one or more reduced thickness portions that are configured to limit the return current paths and control current flow passing through the flange to the transistor die.
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