Method for building vertical pillar interconnect
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United States of America Patent
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Apr 18, 2017
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app pub date -
Mar 14, 2013
filing date -
Jul 2, 2009
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Abstract
An exemplary method includes forming a vertical pillar overlying or laterally displaced from a bond pad overlying a semiconductor substrate, and applying a discrete solder sphere in combination with one of a solder paste or flux on a top surface of the pillar, wherein the one of the solder paste or flux is defined by at least one photoresist layer. The method may include applying a solder sphere and/or solder flux in different combinations on top surfaces of different first and second pillars.
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