Buffer element and manufacturing method thereof, backlight module, and display device
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United States of America Patent
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Apr 18, 2017
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N/A
app pub date -
Jun 24, 2014
filing date -
Apr 30, 2014
priority date (Note) -
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Abstract
A buffer element and a manufacturing method thereof, a backlight module, and a display device are disclosed. When the buffer element is applied to the backlight module, the problem caused by thermal expansion of the light guide plate can be effectively solved without needing to reserve a gap in the backlight module, the relative movement of the light guide plate is avoided and the optical quality of the backlight module is improved. The buffer element comprises a buffer body, wherein the buffer body comprises a curable adhesive, and a negative thermal expansion material dispersed in the curable adhesive.
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