Interlocking door frame and wall panels for modular building units
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Apr 18, 2017
Grant Date -
Jan 21, 2016
app pub date -
Jul 17, 2015
filing date -
Jul 18, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed is a system of interlocking door frame and wall panels for modular building units. Both the door frame panel and the wall panels are provided for easy installation into the skeletal frame of the modular building unit, and are provided with mating male and female connecting edges on opposite sides of each panel. This allows the door frame panel to mate with an adjacent wall panel in the same manner in which adjacent wall panels mate with one another, ensuring a clean, finished appearance for the connecting edges, a strong, reinforced frame having long durability, and a connection having the same physical, structural integrity as the connections between adjacent wall panel units. The door frame panel itself is particularly configured to receive a traditional, commercially available steel door frame and door assembly, but allows fitment of such commercially available steel door frame and door assembly without cutting a wall panel to receive that frame.
First Claim
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Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- WILLIAMS SCOTSMAN, INC.
International Classification(s)

- 2015 Application Filing Year
- E06B Class
- 839 Applications Filed
- 647 Patents Issued To-Date
- 77.12 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Bottin, Herve | La Baule, FR | 5 | 44 |
# of filed Patents : 5 Total Citations : 44 |
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- No Cited Art to Display

Patent Citation Ranking
- 4 Citation Count
- E06B Class
- 25.33 % this patent is cited more than
- 8 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 18, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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Sep 27, 2016 | I | Issuance | |
Sep 07, 2016 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Dec 24, 2015 | P | Published | |
Sep 01, 2015 | F | Filing |

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