Resin composition and film formed from said resin composition

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United States of America Patent

PATENT NO 9624347
SERIAL NO

14650990

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Abstract

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The present invention provides the resin composition having excellent inflation moldability by which a film having high water vapor transmission rate (WVTR) and low elastic modulus can be produced, and a film which is formed from the resin composition. The present invention relates to a resin composition comprising a polyamide resin (A) and a polyvinyl alcohol-based resin (B) which includes 2-10% by mole of structural unit represented by the following general formula (1) and has a degree of saponification of 70-90% by mole, and a film which is formed from the resin composition.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CHEMICAL CORPORATION1-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 1008251 ?1008251

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Kaoru Osaka, JP 178 2354
Sakai, Norihito Osaka, JP 23 82

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