High-frequency module and microwave transceiver
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United States of America Patent
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Apr 11, 2017
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N/A
app pub date -
Mar 1, 2016
filing date -
Mar 5, 2015
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Abstract
A high-frequency module according to an embodiment includes a first board, a first device, a second board, a metal core, and a casing. The first board is formed with an opening, and has a surface at a first side on which a transmission circuit transmitting microwaves is formed. The first device is disposed in the opening of the first board. The second substrate is disposed at a second side of the first board. The second substrate is formed with a control circuit for the first device, and has an opening at a location overlapping the first device. The metal core is disposed between the first board and the second board, and is in contact with the first device. The casing includes a connection connected with the metal core via an opening formed in the second board.
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